J.-M. Dorkel: search on Z-Library

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1

Le soutien aux aidants familiaux : quelles réflexions pour une juste adaptation de nos pratiques professionnelles ?

Journal:

Éthique & Santé

Year:

2018

Language:

french

File:

PDF, 510 KB

french, 2018

2

A new approach to thermal analysis of power devices

Leturcq, P., Dorkel, J.-M., Napieralski, A., Lachiver, E.

Journal:

IEEE Transactions on Electron Devices

Year:

1987

Language:

english

File:

PDF, 995 KB

english, 1987

3

Carrier mobilities in silicon semi-empirically related to temperature, doping and injection level

J.M. Dorkel, Ph. Leturcq

Journal:

Solid-State Electronics

Year:

1981

Language:

english

File:

PDF, 457 KB

english, 1981

4

Source electrode evolution of a low voltage power MOSFET under avalanche cycling

B. Bernoux, R. Escoffier, P. Jalbaud, J.M. Dorkel

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 722 KB

english, 2009

5

A two-port network formalism for 3D heat conduction analysis in multilayered media

Ph. Leturcq, J.M. Dorkel, F.E. Ratolojanahary, S. Tounsi

Journal:

International Journal of Heat and Mass Transfer

Year:

1993

Language:

english

File:

PDF, 2.75 MB

english, 1993

6

Estimation of power MOSFET junction temperature during avalanche mode: Experimental tests and modelling

Azoui, T., Tounsi, P., Dorkel, J.M., Reynes, J.M., Massol, J.L., Pomes, E.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.00 MB

english, 2013

7

Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications

A. Hamidi, G. Coquery, R. Lallemand, P. Vales, J.M. Dorkel

Journal:

Microelectronics Reliability

Year:

1998

Language:

english

File:

PDF, 606 KB

english, 1998

8

Latchup criteria in insulated gate p-n-p-n structures

Hachad, S., Cros, C., Darees, D., Dorkel, J.M., Leturcq, P.

Journal:

IEEE Transactions on Electron Devices

Year:

1985

Language:

english

File:

PDF, 634 KB

english, 1985

9

[IEEE 2012 28th International Conference on Microelectronics (MIEL 2012) - Nis, Serbia (2012.05.13-2012.05.16)] 2012 28th International Conference on Microelectronics Proceedings - Investigation of failure mechanisms in low-voltage power VDMOSFETs linked with gate oxide process quality

Pomes, E., Reynes, J.-M., Tounsi, P., Dorkel, J.-M.

Year:

2012

Language:

english

File:

PDF, 391 KB

english, 2012

10

3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs

T. Azoui, P. Tounsi, Ph. Dupuy, L. Guillot, J.M. Dorkel

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 971 KB

english, 2011

11

Etude de la fiabilite des varactors pour hyperfrequences de structure “MESA”

Journal:

Microelectronics Reliability

Year:

1971

File:

PDF, 428 KB

1971

12

Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits

Dorkel, J.-M., Tounsi, P., Leturcq, P.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1996

Language:

english

File:

PDF, 1.02 MB

english, 1996

13

Study of mechanical stress impact on the I–V characteristics of a power VDMOS device using 2D FEM simulations

E. Marcault, M. Breil, A. Bourennane, P. Tounsi, J.-M. Dorkel

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.56 MB

english, 2012

14

Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue

B. Khong, P. Tounsi, Ph. Dupuy, X. Chauffleur, M Legros, A. Deram, C. Levade, G. Vanderschaeve, J.-M. Dorkel, J.-P. Fradin

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 3.00 MB

english, 2005

15

Characterization method of thermomechanical parameters for microelectronic materials

O. Perat, J.M. Dorkel, E. Scheid, P. Temple Boyer, Y.S. Chung, A. Peyre-Lavigne, M. Zecri, P. Tounsi

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 247 KB

english, 2002

16

[IEEE 12th International Symposium on Power Semiconductor Devices & ICs. Proceedings - Toulouse, France (22-25 May 2000)] 12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094) - Advanced power copper technology for SMARTMOS/sup TM/ application designs

Pages, I., Baird, B., Wang, J., Sicard, T., Dorkel, J.M., Dupuy, P., Lance, P., Huynh, E., Chung, Y.

Year:

2000

Language:

english

File:

PDF, 306 KB

english, 2000

17

The mirrored lateral SCR (MILSCR) as an ESD protection structure: design and optimization using 2-D device simulation

Delage, C., Nolhier, N., Bafleur, M., Dorkel, J.-M., Hamid, H., Givelin, P., Lin-Kwang, J.

Journal:

IEEE Journal of Solid-State Circuits

Year:

1999

Language:

english

File:

PDF, 293 KB

english, 1999

18

[IEEE 12th International Symposium on Power Semiconductor Devices & ICs. Proceedings - Toulouse, France (22-25 May 2000)] 12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094) - Reliability characterization of LDMOS transistors submitted to multiple energy discharges

Bosc, J.-M., Percheron-Garcon, I., Huynh, E., Lance, P., Pages, I., Dorkel, J.M., Sarrabayrouse, G.

Year:

2000

Language:

english

File:

PDF, 445 KB

english, 2000

19

Temperature Sensing for Power MOSFETs in Short-Duration Avalanche Mode

Azoui, Toufik, Tounsi, Patrick, Pasquet, G., Reynes, Jean-Michel, Pomes, Emilie, Dorkel, Jean-Marie

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 674 KB

english, 2014

20

[IEEE 2000 BIPOLAR/BiCMOS Circuits and Technology Meeting 2000 - Minneapolis, MN, USA (24-26 Sept. 2000)] Proceedings of the 2000 BIPOLAR/BiCMOS Circuits and Technology Meeting (Cat. No.00CH37124) - Analysis and compact modeling of a vertical grounded-base NPN bipolar transistor used as an ESD protection in a smart power technology

Bertrand, G., Delage, C., Bafleur, M., Nolhier, N., Dorkel, J.M., Nguyen, Q., Mauran, N., Perdu, P.

Year:

2000

Language:

english

File:

PDF, 367 KB

english, 2000

21

[IEEE Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (9-11 March 2004)] Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) - New method for electrothermal simulations: HDTMOS in automotive applications

Tounsi, P., Dorkel, J.M., Dupuy, P., Chauffleur, X., Fradin, J.P., Feybesse, A., Chaunut, F.

Year:

2004

Language:

english

File:

PDF, 465 KB

english, 2004

22

[IEEE 1996 BIPOLAR/BiCMOS Circuits and Technology Meeting - Minneapolis, MN, USA (29 Sept.-1 Oct. 1996)] Proceedings of the 1996 BIPOLAR/BiCMOS Circuits and Technology Meeting - Electrothermal simulation methodology for power devices and integrated circuits

Vales, P., Dorkel, J.-M.

Year:

1996

Language:

english

File:

PDF, 430 KB

english, 1996

23

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - New method of dynamic compact thermal model extraction

Habra, W., Tounsi, P., Madrid, F., Dorkel, J. -M.

Year:

2008

Language:

english

File:

PDF, 443 KB

english, 2008

24

[IEEE Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004 - Brussels, Belgium (10-12 May 2004)] 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the - Thermo-mechanical stress modelling of MOS device with electro-thermal considerations

Tounsi, P., Chauffleur, X., Dorkel, J.-M., Fradin, J.-P., Dupuy, Ph., Marty, A., Deram, A.

Year:

2004

Language:

english

File:

PDF, 623 KB

english, 2004

25

[IEEE 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (2009.03.15-2009.03.19)] 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Adaptive multiple cooling surfaces Compact Thermal Model (CTM), and boundary condition independent multiple heat sources CTM

Tounsi, Patrick, Sauveplane, Jean-Baptiste, Nowakowski, Jerzy Piotr, Madrid, Francesc, Jean-Marie-Dorkel,

Year:

2009

Language:

english

File:

PDF, 1.23 MB

english, 2009

26

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Improved 3D-nonlinear compact modelling for power components

Habra, W., Tounsi, P., Dorkel, J.-M.

Year:

2005

Language:

english

File:

PDF, 559 KB

english, 2005

27

[IEEE 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Budapest, Hungary (2007.09.17-2007.09.19)] 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - A new methodology for extraction of dynamic compact thermal models

Habra, W., Tounsi, P., Madrid, F., Dupuy, Ph., Barbot, C., Dorkel, J-M.

Year:

2007

Language:

english

File:

PDF, 1.02 MB

english, 2007

28

Analysis and compact modeling of a vertical grounded-base n-p-n bipolar transistor used as ESD protection in a smart power technology

Bertrand, G., Delage, C., Bafleur, M., Nolhier, N., Dorkel, J.-M., Nguyen, Q., Mauran, N., Tremouilles, D., Perdu, P.

Journal:

IEEE Journal of Solid-State Circuits

Year:

2001

Language:

english

File:

PDF, 221 KB

english, 2001

29

Two-port network theory based thermal characterization of power module packages

Ratolojanahary, F. E., Dorkel, J. M., Tounsi, P.

Journal:

The European Physical Journal Applied Physics

Year:

2002

Language:

english

File:

PDF, 280 KB

english, 2002

30

[IEEE 2009 IEEE International Symposium on Industrial Electronics (ISIE 2009) - Seoul, South Korea (2009.07.5-2009.07.8)] 2009 IEEE International Symposium on Industrial Electronics - Power MOSFET RDSon under repetitive avalanche cycling

Bernoux, Beatrice, Escoffier, Rene, Jalbaud, Pierre, Reynes, Jean-Michel, Scheid, Emmanuel, Dorkel, Jean-Marie

Year:

2009

Language:

english

File:

PDF, 2.69 MB

english, 2009

31

SPIE Proceedings [SPIE Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS - Paris, France (Tuesday 9 May 2000)] Design, Test, Integration, and Packaging of MEMS/MOEMS - New methodology of work with concurrent engineering in electronic design

Owezarski, P., Baudin, V., Owezarski, S., Fabre, G., Gayraud, T., Dorkel, J. M., Tounsi, P., Courtois, Bernard, Crary, Selden B., Gabriel, Kaigham J., Karam, Jean Michel, Markus, Karen W., Tay, Andrew

Year:

2000

Language:

english

File:

PDF, 786 KB

english, 2000

32

Thermal characterization of LDMOS transistors for accelerating stress testing

J.M Bosc, P Dupuy, J Gil, J.M Dorkel, G Sarrabayrouse

Journal:

Microelectronics Journal

Year:

2000

Language:

english

File:

PDF, 347 KB

english, 2000

33

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Electro-thermal modeling to quantify the electrothermal impact of the solder joint delamination on power device assemblies

Azoui, T., Marcault, E., Tounsi, P., Massol, J. L., Dorkel, J. M., Dupuy, P.

Year:

2013

Language:

english

File:

PDF, 1.11 MB

english, 2013

34

[IEEE IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging - Chicago, IL, USA (17-19 Sept. 1998)] IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203) - On-state transient electrothermal modeling of large area power components and multichip power modules

Bellil, K., Tounsi, P., Dorkel, J.-M.

Year:

1998

Language:

english

File:

PDF, 603 KB

english, 1998

35

[IEEE Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting - Montreal, Canada (Sept. 12-14, 2004)] Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting - Non linear 3D electrothermal investigation on power MOS chips

Chauffieu, X., Tounsi, P., Dorkel, J.-M., Dupuy, P., Fradin, J.-P.

Year:

2004

Language:

english

File:

PDF, 257 KB

english, 2004

36

VDMOS electrical parameters potentially usable as mechanical state indicators for power VDMOS assemblies

Breil, Marie, Marcault, Emmanuel, Tounsi, Patrick, Dorkel, Jean-Marie, Bourennane, Abdelhakim

Journal:

IET Circuits Devices & Systems

Year:

2014

Language:

english

File:

PDF, 1.09 MB

english, 2014

37

[IEEE [Proceedings] 1992 IEEE Workshop on Computers in Power Electronics - Berkeley, CA, USA (9-11 Aug. 1992)] [Proceedings] 1992 IEEE Workshop on Computers in Power Electronics - A comparative study of two simulation methods for thermal analysis of power electronic devices

Napieralski, A., Skorek, A., Dorkel, J.-M.

Year:

1992

Language:

english

File:

PDF, 798 KB

english, 1992

38

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Impact of circuit load on the ageing mode of VDMOS chips using 3D FEM electro-thermal modelling

Marcault, E., Massol, J. L., Tounsi, P., Dorkel, J. M.

Year:

2013

Language:

english

File:

PDF, 1.29 MB

english, 2013

39

On electrical transport in non-isothermal semi-conductors

Journal:

Solid-State Electronics

Year:

1983

Language:

english

File:

PDF, 152 KB

english, 1983

40

Innovative methodology to extract dynamic compact thermal models: Application to power devices

Toufik Azoui, Patrick Tounsi, Jean-Marie Dorkel

Journal:

Microelectronics Journal

Year:

2012

Language:

english

File:

PDF, 586 KB

english, 2012

41

[IEEE 1998 Bipolar/BiCMOS Circuits and Technology Meeting - Minneapolis, MN, USA (27-29 Sept. 1998)] Proceedings of the 1998 Bipolar/BiCMOS Circuits and Technology Meeting (Cat. No.98CH36198) - The Mirrored Lateral SCR (MILSCR) as an ESD protection structure for smart power applications

Delage, C., Nolhier, N., Bafleur, M., Dorkel, J.M., Hamid, J., Givelin, P., Lin-Kwang, J.

Year:

1998

Language:

english

File:

PDF, 427 KB

english, 1998

42

[IEEE 2011 IEEE Global Engineering Education Conference (EDUCON) - Amman, Jordan (2011.04.4-2011.04.6)] 2011 IEEE Global Engineering Education Conference (EDUCON) - GIP-CNFM: a French education network moving from microelectronics to nanotechnologies CNFM: National coordination for education in microelectronics and nanotechnologies

Bonnaud, Olivier, Gentil, Pierre, Bsiesy, Ahmad, Retailleau, Sylvie, Dufour-Gergam, Elizabeth, Dorkel, Jean-Marie

Year:

2011

Language:

english

File:

PDF, 1.12 MB

english, 2011

43

[IEEE 8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings - Maui, HI, USA (20-23 May 1996)] 8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings - Rapid thermal modeling for smart-power and integrated multichip power circuit design

Dupuy, P., Dorkel, J.-M., Tounsi, P., Borucki, L.

Year:

1996

Language:

english

File:

PDF, 434 KB

english, 1996

44

[IEEE 2000 22nd International Conference on Microelectronics. Proceedings - Nis, Yugoslavia (14-17 May 2000)] 2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400) - Advanced concepts in smart power integrated circuits

Rossel, P., Cezac, N., Charitat, G., Dorkel, J.M., Morancho, F., Pages, I., Tranduc, H., Zitouni, M.

Year:

1999

Language:

english

File:

PDF, 882 KB

english, 1999

45

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Boundary condition independent multiple cooling surfaces transient compact thermal model

Azoui, Toufik, Tounsi, Patrick, Dorkel, Jean-Marie

Year:

2010

Language:

english

File:

PDF, 869 KB

english, 2010

46

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Dynamic Compact Thermal Model for electrothermal modeling and design optimization of automotive power devices

Azoui, T., Tounsi, P., Pasquet, G., Dupuy, Ph., Dorkel, J.M.

Year:

2011

Language:

english

File:

PDF, 1.51 MB

english, 2011

47

[IEEE Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings - Austin, TX, USA (5-7 March 1996)] Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings - 3D thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits

Dorkel, J.-M., Tounsi, P., Leturcq, P.

Year:

1996

Language:

english

File:

PDF, 632 KB

english, 1996

48

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Numerical and experimental results correlation during power MOSFET ageing

Azoui, T., Tounsi, P., Dupuy, Ph., Dorkel, J.M., Martineau, D.

Year:

2012

Language:

english

File:

PDF, 631 KB

english, 2012

49

[IEEE 2010 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - BCTM - Austin, TX, USA (2010.10.4-2010.10.6)] 2010 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) - Dynamic compact thermal model for smart electro-thermal simulation: Application to automotive power device

Azoui, T., Tounsi, P., Dupuy, Ph., Dorkel, J-M.

Year:

2010

Language:

english

File:

PDF, 224 KB

english, 2010

50

IMPLEMENTATION OF A NEW METHOD FOR THERMAL ANALYSIS OF PLANE MULTILAYERED SYSTEMS

Dorkel, J. M., Napieralski, A., Leturcq, Ph.

Journal:

Numerical Heat Transfer

Year:

1988

Language:

english

File:

PDF, 470 KB

english, 1988

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